Patent Number: 7,785,673

Title: Hot melt application system

Abstract: Hot melt adhesive pellets are melted and pressure pumped in a controlled application pattern on the substrate at the application site. The high frequency power supply, induction heated melting susceptor, pressure pump, and pattern control electronics are all contained in a single unit within adhesive projection distance.

Inventors: Lasko; Bernard (Spartanburg, SC)


International Classification: H05B 6/02 (20060101); B29C 35/08 (20060101)

Expiration Date: 8/31/12018