Patent Number: 7,785,924

Title: Method for making semiconductor chips having coated portions

Abstract: A method for making semiconductor chips having coated portions can include mounting the chips in lead frames, stacking the lead frames in an orientation in which a portion of one lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating, and depositing a coating on the stacked lead frames using, for example, an evaporative coating machine. In this manner, the coating is deposited on exposed portions of chips, such as its edges, and is not deposited on masked portions of chips, such as bond pads.

Inventors: McColloch; Laurence Ray (Santa Clara, CA)

Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.

International Classification: H01L 21/00 (20060101)

Expiration Date: 8/31/12018