Patent Number: 7,786,001

Title: Electrical interconnect structure and method

Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Inventors: Buchwalter; Stephen Leslie (Hopewell Junction, NY), Furman; Bruce K. (Poughquag, NY), Gruber; Peter A. (Mohegan Lake, NY), Nah; Jae-Woong (Yorktown Heights, NY), Shih; Da-Yuan (Poughkeepsie, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 21/44 (20060101)

Expiration Date: 8/31/12018