Patent Number: 7,786,225

Title: Curable resin composition

Abstract: A curable resin composition, which is a solid resin at ordinary temperatures obtained by reacting an epoxy resin with a (meth)acrylic anhydride, contains an unsaturated resin having a (meth)acryloyl group (A) which has a double bond equivalent weight of 200 to 500, an ester number of 100 to 300, and a hydroxyl number of no more than 130, an ethylenically unsaturated monomer (B), and a radical polymerization initiator (C).

Inventors: Yasumura; Takashi (Osaka, JP), Tomiyama; Takashi (Osaka, JP), Harada; Tetsuya (Osaka, JP)

Assignee: DIC Corporation

International Classification: C08F 283/10 (20060101)

Expiration Date: 8/31/12018