Patent Number: 7,786,242

Title: Ring-containing modified resins and dispersants including it

Abstract: The ring-containing modified resin is represented by the following chemical formula (1) R.sup.1[--(--O--CO--NH--R.sup.2--NH--CO--O--R.sup.3--).sub.p--O--R.sup.4]- .sub.q (1) (in the chemical formula (1), R.sup.1 is a dehydroxyl residue of a resin having a benzene ring and/or a condensed ring and hydroxyl group: --R.sup.2-- is deisocyanate group derived from an organic diisocyanate: --R.sup.3-- is a dehydroxyl residue of polyol having number-average molecular weight of 200 to 30000: p is 1 to 3: --R.sup.4 is a hydrogen atom, alkyl group having 1 to 18 carbons, phenyl group: q is the same number as the number of the dehydroxyl residue of R.sup.1).

Inventors: Hosoda; Motoe (Nara, JP)

Assignee: Kyoeisha Chemical Co., Ltd.

International Classification: C08G 18/42 (20060101); C08G 18/62 (20060101); C08G 18/64 (20060101); C08G 18/48 (20060101); C07C 271/06 (20060101)

Expiration Date: 8/31/12018