Patent Number: 7,786,515

Title: Solid-state imaging device and method of manufacturing the same

Abstract: A solid-state imaging device including: a semiconductor substrate on which an imaging region having a light receiving section is formed; and a predetermined layer formed on the semiconductor substrate by planarization processing using liquid containing a metal element, wherein at least a first diffusion protection film is formed between the light receiving section and the predetermined layer.

Inventors: Watanabe; Shinya (Nagasaki, JP)

Assignee: Sony Corporation

International Classification: H01L 31/062 (20060101)

Expiration Date: 8/31/12018