Patent Number: 7,786,567

Title: Substrate for electrical device and methods for making the same

Abstract: Substrate for electrical devices and methods of manufacturing such substrate are disclosed. An embodiment for the substrate comprised of an insulator and a plurality of conductive elements, wherein the conductive elements embedded in the insulator, and two surfaces of the conductive element exposed to two surfaces of the insulator for electrical connection respectively, meanwhile a portion of conductive element may protrude the insulator, in this manner, solder balls are not needed, moreover the conductive element of substrate may further include either an extending portion or a protruding portion, and the present invention may be capable of affording a thinner electrical device thickness, enhanced reliability, and a decreased cost in production.

Inventors: Wang; Chung-Cheng (Taichung, TW)


International Classification: H01L 23/48 (20060101); H01L 21/48 (20060101)

Expiration Date: 8/31/12018