Patent Number: 7,786,572

Title: System in package (SIP) structure

Abstract: A System In Package (SIP) arrangement and method of connecting a plurality of flip chips and wire bond chips with reduced wiring complexity and increase flexibility. The SIP arrangement includes at least one wire bond chip and at least one flip chip.

Inventors: Chen; Hsien-Wei (Sinying, TW)

Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.

International Classification: H01L 23/34 (20060101); H01L 21/00 (20060101)

Expiration Date: 8/31/12018