Patent Number: 7,786,598

Title: Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device

Abstract: A semiconductor chip is provided comprising a semiconductor substrate on which an integrated circuit is formed. The semiconductor chip, which is provided on the semiconductor substrate in an area array, further comprises a plurality of electrodes electrically coupled with the inside of the semiconductor substrate, wherein the electrodes are arranged into a plurality of first groups respectively lined along a plurality of paralleling first straight lines and, further, into a plurality of second groups respectively lined along a plurality of second straight lines which extend so as to intersect with the first straight lines.

Inventors: Yuzawa; Hideki (Iida, JP)

Assignee: Seiko Epson Corporation

International Classification: H01L 23/48 (20060101); H01L 23/40 (20060101); H01L 23/52 (20060101)

Expiration Date: 8/31/12018