Patent Number: 7,787,687

Title: Pattern shape evaluation apparatus, pattern shape evaluation method, method of manufacturing semiconductor device, and program

Abstract: A pattern shape evaluation method includes acquiring design data accompanied by an evaluation area in which information on a particular evaluation area within a pattern of a semiconductor device is added to the design data for the pattern, acquiring an image of the pattern, generating edge data for the pattern from the image of the pattern, aligning the design data accompanied by the evaluation area with the edge data and evaluating the shape of the pattern within the evaluation area after the alignment.

Inventors: Miyano; Yumiko (Tokyo, JP), Mitsui; Tadashi (Kamakura, JP)

Assignee: Kabushiki Kaisha Toshiba

International Classification: G06K 9/00 (20060101)

Expiration Date: 8/31/12018