Patent Number: 7,819,980

Title: System and method for removing particles in semiconductor manufacturing

Abstract: A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.

Inventors: Hsia; Chen-Yuan (Hsin-Chu, TW), Hung; Chang-Cheng (Hsin-Chu, TW), Lu; Chi-Lun (Changhua, TW), Chang; Shih-Ming (Hsin-Chu, TW), Wang; Wen-Chuan (Taipei, TW), Huang; Yen-Bin (Tainan, TW), Chang; Ching-Yu (Yilang, TW), Lin; Chin-Hsiang (Hsin-Chu, TW)

Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.

International Classification: C25F 1/00 (20060101); C25F 3/30 (20060101); C25F 5/00 (20060101)

Expiration Date: 2018-10-26 0:00:00