Patent Number: 7,820,051

Title: Recycling of electrochemical-mechanical planarization (ECMP) slurries/electrolytes

Abstract: A method, process and system for the recycling of electrochemical-mechanical planarization slurries/electrolytes as they are used in the back end of line of the semiconductor wafer manufacturing process is disclosed. The method, process and system includes with the removal of metal ions from slurries using ion exchange media and/or electrochemical deposition.

Inventors: Fang; Rui (Fishkill, NY), Kulkarni; Deepak (Wappingers Falls, NY), Watts; David K. (Hopewell Junction, NY)

Assignee: International Business Machines Corporation

International Classification: B01D 11/00 (20060101)

Expiration Date: 2018-10-26 0:00:00