Patent Number: 7,820,084

Title: Minute shape molding method and apparatus thereof

Abstract: A method of molding a minute shape, in which at least one of a pair of dies is provided with an uneven section of a minute shape on a molding surface thereof, clamping of the pair of dies is stopped immediately before the dies are completely clamped, a resin is injected into a cavity, and thereafter the dies are completely clamped to thereby transcribe the shape of the uneven section onto the resin includes preparing a plurality of transcription dies each provided with the uneven section on a molding surface thereof, heating one of the transcription dies which is not used to mold a product by a heating unit, and exchanging the transcription dies with each other, at a point in time at which molding is completed, to thereby mold the product continuously.

Inventors: Takemoto; Atsushi (Gotenba, JP), Koike; Jun (Sunto-gun, JP)

Assignee: Toshiba Kikai Kabushiki Kaisha

International Classification: B29C 45/04 (20060101)

Expiration Date: 2018-10-26 0:00:00