Patent Number: 7,820,093

Title: Method for processing stamp material

Abstract: A method for processing a stamp material generally includes: heating one of a pressing member and a surface layer of the stamp material; pressing the surface layer of the stamp material using the pressing member; and cooling the stamp material to normal temperature.

Inventors: Wong; Kin Sun (Tuen Mun, HK), Wan; Kam Hung (Tuen Mun, HK), Tsang; Hin Wah Wallace (Tuen Mun, HK), Wan; Kam Kwong Raymond (Tuen Mun, HK)


International Classification: B29C 59/02 (20060101); B29C 59/04 (20060101)

Expiration Date: 2018-10-26 0:00:00