Patent Number: 7,820,112

Title: Method and apparatus for manufacturing beads array chip

Abstract: A bead array chip manufacturing process for manufacturing a bead array chip having plural kinds of beads arrayed in a predetermined order in, in a container having a plurality of first channels disposed substantially in parallel with each other and a second channel crossing the plurality of first channels, each of the first channels. The process including lowering a capillary inserted in the second channel and sucking and retaining one bead in one end of the capillary, lifting the capillary to position the beads retained in the one end of the capillary in a desired channel of the plurality of first channels, terminating the suction of the capillary, and generating a uniflow of a fluid in the second channel.

Inventors: Noda; Hideyuki (Kokubunji, JP), Kohara; Yoshinobu (Kokubunji, JP)

Assignee: Hitachi, Ltd.

International Classification: B01L 3/02 (20060101)

Expiration Date: 2018-10-26 0:00:00