Patent Number: 7,820,273

Title: Substrate structure with patterned layer

Abstract: A substrate structure includes a substrate, a number of banks formed on the substrate, and a patterned layer. The banks and the substrate cooperatively define a number of accommodating rooms. The accommodating rooms are configured for accommodating ink. The patterned layer covers the bank between at least two adjacent accommodating rooms.

Inventors: Chou; Ching-Yu (Taipei Hsien, TW), Wang; Yu-Ning (Taipei Hsien, TW)

Assignee: Hon Hai Precision Industry Co., Ltd.

International Classification: B32B 27/00 (20060101)

Expiration Date: 2018-10-26 0:00:00