Patent Number: 7,820,367

Title: Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the same

Abstract: The object of the present invention is to provide a process for forming a resist pattern that is capable to utilize excimer laser beam, the thickening level of the resist pattern is controllable uniformly, constantly and precisely, without being affected substantially by environmental changes such as temperatures and humidity, and storage period, and space pattern of resist may be formed with a fineness exceeding exposure limits or resolution limits of available irradiation sources. The process for producing a semiconductor device is characterized in that forming a resist pattern on a surface of workpiece, coating a resist pattern thickening material on the resist pattern, thickening the resist pattern to form a thickened resist pattern, and patterning the surface of workpiece by etching using the thickened resist pattern as a mask, wherein the resist pattern thickening material comprises a resin, and exhibits a pH value of above 7 and not over 14 at coating or after coating on the resist pattern.

Inventors: Kozawa; Miwa (Kawasaki, JP), Nozaki; Koji (Kawasaki, JP), Namiki; Takahisa (Kawasaki, JP)

Assignee: Fujitsu Limited

International Classification: G03F 7/26 (20060101); G03F 7/40 (20060101)

Expiration Date: 2018-10-26 0:00:00