Patent Number: 7,820,479

Title: Conductive ball mounting method

Abstract: There is provided a method of mounting one conductive ball on each of a plurality of connection pads on a substrate. The method includes: (a) providing a pre-alignment base including: a support layer formed to allow a flux to pass therethrough; and an alignment layer provided on the support layer and having pockets for containing the conductive ball; (b) applying a paste containing the conductive balls dispersed in the flux onto the alignment layer such that each of the pockets receives one of the conductive balls together with the flux; (c) aligning the pre-alignment base with the substrate such that each of the pockets corresponds to one of the connections pads; and (d) transferring the paste contained in each of the pockets onto the connection pads, thereby mounting the conductive balls along with the flux on the connection pads.

Inventors: Sakaguchi; Hideaki (Nagano, JP)

Assignee: Shinko Electric Industries Co., Ltd.

International Classification: H01L 21/44 (20060101); H01L 21/48 (20060101); H01L 21/50 (20060101)

Expiration Date: 2018-10-26 0:00:00