Patent Number: 7,820,487

Title: Manufacturing method of semiconductor device

Abstract: A manufacturing method of a semiconductor device includes providing an adhesive on a supporting board, the supporting board being where a semiconductor element is to be mounted; providing a member configured to block flow of the adhesive on a first main surface of the semiconductor element, the semiconductor element having a second main surface where an outside connection terminal is provided; mounting the semiconductor element on a part of the supporting board where the adhesive is provided by pressing the semiconductor element via the member.

Inventors: Teshirogi; Kazuo (Kawasaki, JP), Shimobeppu; Yuzo (Kawasaki, JP), Yoshimoto; Kazuhiro (Kawasaki, JP), Shinjo; Yoshiaki (Kawasaki, JP)

Assignee: Fujitsu Semiconductor Limited

International Classification: H01L 21/00 (20060101)

Expiration Date: 2018-10-26 0:00:00