Patent Number: 7,820,488

Title: Microelectronic devices and methods

Abstract: A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.

Inventors: Sri-Jayantha; Sri M. (Ossining, NY), Hougham; Gareth (Ossining, NY), Kang; Sung (Chappaqua, NY), Mok; Lawrence (Brewster, NY), Dang; Hien (Nanuet, NY), Sharma; Arun (New Rochelle, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 21/00 (20060101)

Expiration Date: 2018-10-26 0:00:00