Patent Number: 7,820,545

Title: Methods of forming conductive interconnects

Abstract: The invention includes methods of electroless plating of nickel selectively on exposed conductive surfaces relative to exposed insulative surfaces. The electroless plating can utilize a bath which contains triethanolamine, maleic anhydride and at least one nickel salt.

Inventors: Tiwari; Chandra (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 21/4763 (20060101); H01L 21/44 (20060101)

Expiration Date: 2018-10-26 0:00:00