Patent Number: 7,820,742

Title: Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C

Abstract: Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80.degree. C. of not more than 10,000 Pas, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80.degree. C. to (T+50).degree. C., exhibits a melt viscosity at a temperature of 100.degree. C. to (T+30).degree. C. that is within a range from 100 to 10,000 Pas (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

Inventors: Ichiroku; Nobuhiro (Tomioka, JP), Kozakai; Shouhei (Annaka, JP)

Assignee: Shin-Etsu Chemical Co., Ltd.

International Classification: B32B 27/38 (20060101); C08K 3/36 (20060101); C08L 63/02 (20060101); C08L 79/08 (20060101)

Expiration Date: 2018-10-26 0:00:00