Patent Number: 7,821,126

Title: Heat sink with preattached thermal interface material and method of making same

Abstract: A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The thermal interface material can have one of several cross-sectional profiles to facilitate reflow thereof against a die during a method of assembling a packaged microelectronic device. The thermal interface material can also have one of several footprints to further facilitate reflow thereof against the die.

Inventors: Houle; Sabina J. (Phoenix, AZ), Deppisch; Carl (Phoeniz, AZ)

Assignee: Intel Corporation

International Classification: H01L 23/34 (20060101)

Expiration Date: 2018-10-26 0:00:00