Patent Number: 7,821,279

Title: Element substrate, inspecting method, and manufacturing method of semiconductor device

Abstract: A substrate including a semiconductor layer, where characteristics of an element can be evaluated with high reliability, and an evaluating method thereof are provided. A substrate including a semiconductor layer of the invention has a closed-loop circuit in which an antenna coil and a semiconductor element are connected in series, and a surface of an area over which the circuit is formed is covered with an insulating film. By using such a circuit, a contactless inspection can be carried out. Further, a ring oscillator can be substituted for the closed-loop circuit.

Inventors: Kato; Kiyoshi (Kanagawa, JP), Izumi; Konami (Kanagawa, JP), Hayakawa; Masahiko (Kanagawa, JP), Kamata; Koichiro (Kanagawa, JP)

Assignee: Semiconductor Energy Laboratory Co., Ltd.

International Classification: G01R 31/26 (20060101)

Expiration Date: 2018-10-26 0:00:00