Patent Number: 7,821,283

Title: Circuit board apparatus for wafer inspection, probe card, and wafer inspection apparatus

Abstract: Disclosed herein are a circuit board device for wafer inspection having high connection reliability, and a probe card and a wafer inspection apparatus, which are equipped with this circuit board device for wafer inspection. The circuit board device for wafer inspection has a board body and a connector device provided on the board body and obtained by stacking a plurality of connector units on each other, wherein each of the connector units has a first anisotropically conductive elastomer sheet, a composite conductive sheet, a second anisotropically conductive elastomer sheet and a pitch converting board, the composite conductive sheet has an insulating sheet, in which a plurality of through-holes have been formed, and rigid conductors respectively arranged into the through-holes in this insulating sheet so as to protrude from both surfaces of the insulating sheet, and in each of the rigid conductors, terminal portions having a diameter greater than the diameter of the through-hole are formed on both ends of a body portion inserted into the through-hole in the insulating sheet in order for the conductor to be provided movably in the thickness-wise direction of the insulating sheet.

Inventors: Yamada; Daisuke (Hidaka, JP), Kimura; Kiyoshi (Hidaka, JP), Hara; Fujio (Hidaka, JP)

Assignee: JSR Corporation

International Classification: G01R 31/26 (20060101)

Expiration Date: 2018-10-26 0:00:00