Patent Number: 7,821,565

Title: Imaging module package

Abstract: An exemplary imaging module package includes a lens module and an imaging sensor module. The lens module includes a housing having a hollow top portion and a hollow bottom portion coaxially aligned with the hollow top portion. The imaging sensor module is received in the hollow bottom portion. The imaging sensor module includes an imaging sensor connected to the substrate and secured to the bottom portion, a substrate spaced from the bottom portion and defining at least one recess therein, and a plurality of passive components received in the at least one recess and wholly disposed below the imaging sensor.

Inventors: Wu; Ying-Cheng (Taipei Hsien, TW), Liu; Pang-Jung (Taipei Hsien, TW), Yao; Chien-Cheng (Taipei Hsien, TW), Lo; Shih-Min (Taipei Hsien, TW)

Assignee: Hon Hai Precision Industry Co., Ltd.

International Classification: H04N 5/225 (20060101); G02B 13/16 (20060101)

Expiration Date: 2018-10-26 0:00:00