Patent Number: 7,821,790

Title: Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and Advanced TCA boards

Abstract: A modular chassis arrangement for electronic modules that is configurable into a mechanically and electrically interconnected structure capable of delivering scalable mechanical, electrical and environmental functionality for a multiplicity of electronic modules. In one embodiment, the electronic modules are compliant with AdvancedTCA or MicroTCA standards in a modular Pico-Shelf configuration that support stackable and/or back-to-back multiple unit chassis.

Inventors: Sharma; Viswa N. (San Ramon, CA), Chu; William (Elmsford, NY), James; Allen D. (Cottage Grove, MN), Tseng; Ming Siu (Fremont, CA), Schlegel; Neil (Deer Park, WI), Lentz; David (Hopkins, MN), Sonnek; Christopher D. (North Saint Paul, MN)

Assignee: SLT Logic, LLC

International Classification: H05K 7/16 (20060101); H05K 5/00 (20060101); H05K 7/00 (20060101)

Expiration Date: 2018-10-26 0:00:00