Patent Number: 7,822,090

Title: Semiconductor device

Abstract: A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than -15.degree. C. and not more than -5.degree. C.

Inventors: Minamio; Masanori (Osaka, JP), Yoshikawa; Noriyuki (Osaka, JP), Ijima; Shinichi (Osaka, JP), Fukuda; Toshiyuki (Kyoto, JP)

Assignee: Panasonic Corporation

International Classification: H01S 5/00 (20060101); H01S 3/30 (20060101); H01S 3/04 (20060101); H01L 29/16 (20060101)

Expiration Date: 2018-10-26 0:00:00