Patent Number: 7,823,279

Title: Method for using an in package power supply to supply power to an integrated circuit and to a component

Abstract: A packaged device may be provided with an in package power supply. The in package power supply may be selectively coupled to another component when the packaged device is not active.

Inventors: Eskildsen; Steven R. (Folsom, CA), Mills; Duane R. (Shingle Springs, CA)

Assignee: Intel Corporation

International Classification: H01R 43/00 (20060101)

Expiration Date: 2019-11-02 0:00:00