Patent Number: 7,823,283

Title: Method of forming a land grid array interposer

Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

Inventors: Hougham; Gareth G. (Ossining, NY), Beaman; Brian S. (Cary, NC), Colgan; Evan G. (Chestnut Ridge, NY), Coteus; Paul W. (Yorktown, NY), Oggioni; Stefano S. (Besana in Brianza, IT), Vargas; Enrique (Bronx, NY)

Assignee: International Business Machines Corporation

International Classification: H01R 43/00 (20060101)

Expiration Date: 2019-11-02 0:00:00