Patent Number: 7,823,618

Title: Ultrasonic bonding apparatus

Abstract: An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

Inventors: Masuda; Yasuyuki (Kawasaki, JP), Ozaki; Yukio (Kawasaki, JP), Matsueda; Jun (Kawasaki, JP), Ikura; Kazuyuki (Kawasaki, JP), Kobayashi; Taizan (Kawasaki, JP), Kasuga; Toshinori (Kawasaki, JP)

Assignee: Fujitsu Limited

International Classification: B32B 37/00 (20060101)

Expiration Date: 2019-11-02 0:00:00