Patent Number: 7,824,146

Title: Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters

Abstract: Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters are described. In one embodiment, a method comprises providing a semiconductor fabrication tool, placing an adapter ring on a plurality of ring holders via a robotic arm, the plurality of ring holders being operable to support the adapter ring at a vertical distance from a stage heater and the stage heater being movable in a vertical direction, placing a first semiconductor wafer on the stage heater via the robotic arm, the first semiconductor wafer having a first diameter, and moving the stage heater upward to receive the adapter ring from the plurality of ring holders and to cover a portion of the stage heater during processing of the first semiconductor wafer.

Inventors: Lanee; Khamsidi (Austin, TX), Moore; Gerry (Valley Mills, TX)

Assignee: Advanced Technology Development Facility

International Classification: H01L 21/677 (20060101)

Expiration Date: 2019-11-02 0:00:00