Patent Number: 7,824,221

Title: Connector

Abstract: The invention provides a connector in which, while miniaturization and thinning are attained at a level equivalent to the conventional art, it is possible to prevent a phenomenon that molten solder drips from a wire connecting portion to form a solder bridge between adjacent contacts, from occurring, and a cable can be soldered to the wire connecting portion with excellent workability and high strength. In the connector of the invention, each of terminal portions (25) of plural contacts (20) which are juxtaposed in the pitch direction has a wire connecting portion (26, 27, 28) to which a lead wire (71, 72, 73, 74) drawn out from a cable (70) is to be soldered. The wire connecting portion is expansively opened along the connector thickness direction which is perpendicular to: an insertion/extraction direction of the connector with respect to a counter connector; and the pitch direction perpendicular to the insertion/extraction direction.

Inventors: Miyoshi; Toshiharu (Osaka, JP)

Assignee: Hosiden Corporation

International Classification: H01R 13/648 (20060101)

Expiration Date: 2019-11-02 0:00:00