Patent Number: 7,824,243

Title: Chemical mechanical planarization methods

Abstract: A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.

Inventors: Hu; Tien-Chen (Ping-Tung, TW), Hou; Jung-Sheng (Tainan, TW), Huang; Chun-Chin (Houbi Shiang, TW)

Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.

International Classification: B24B 49/00 (20060101); B24B 51/00 (20060101)

Expiration Date: 2019-11-02 0:00:00