Patent Number: 7,824,568

Title: Solution for forming polishing slurry, polishing slurry and related methods

Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.

Inventors: Comeau; Joseph K. V. (Essex Junction, VT), Katsnelson; Marina M. (Burlington, VT), Tiersch; Matthew T. (Essex Junction, VT), White; Eric J. (Charlotte, VT)

Assignee: International Business Machines Corporation

International Classification: C09K 13/00 (20060101)

Expiration Date: 2019-11-02 0:00:00