Patent Number: 7,825,005

Title: Multiple substrate electrical circuit device

Abstract: In one embodiment of the disclosure, a method includes providing a carrier substrate, forming a first region over an upper surface of the substrate, creating an electrical component using a planar process, embedding the electrical component in the dielectric layer, and removing a substrate portion of the electrical component. The first region includes a dielectric layer and may be made of any material that electrically isolates the electrical component from the carrier substrate. The electrical component may be created using a planar process thereby having an epitaxial surface that is embedded in the dielectric layer.

Inventors: Chahal; Premjeet (Plano, TX)

Assignee: Raytheon Company

International Classification: H01L 21/30 (20060101)

Expiration Date: 2019-11-02 0:00:00