Patent Number: 7,826,127

Title: MEMS device having a recessed cavity and methods therefor

Abstract: A microelectromechanical systems device having a transparent substrate joined to a planar backplate with a raised perimeter structure forming a recessed cavity or cell. The raised perimeter structure is formed by applying a first layer around the peripheral area of the backplate to form a recessed cell. A second layer is applied over the first layer. The first layer is thicker than the second layer. The thicker layer comprises a viscous material. A second layer is a thinner adhesive layer, and is applied over the thicker layer to join the backplate to the transparent substrate to encapsulate the microelectromechanical systems device formed on the transparent substrate.

Inventors: Khonsari; Nassim (Redwood City, CA), Chui; Clarence (San Jose, CA)

Assignee: QUALCOMM MEMS Technologies, Inc.

International Classification: G02B 26/00 (20060101); G02F 1/03 (20060101); H01L 23/20 (20060101)

Expiration Date: 2019-11-02 0:00:00