Patent Number: 7,951,302

Title: Method for forming bump of probe card

Abstract: A method for forming a bump of a probe card is disclosed. In accordance with the method, a bump having a high aspect ratio for supporting a probe tip and a probe beam is formed using a semiconductor substrate as a mold eliminating a need for a photoresist film.

Inventors: Kim; Bong Hwan (Seoul, KR), Kim; Jong Bok (Goyang-si, KR)

Assignee: Will Technology Co., Ltd

International Classification: H01B 13/00 (20060101)

Expiration Date: 2019-05-31 0:00:00