Patent Number: 8,015,703

Title: Method of manufacturing a wired circuit board

Abstract: A method of manufacturing a wired circuit board including a metal supporting board. An insulating layer is formed on the metal supporting board in a pattern in which concave portions are formed. A conductive pattern in a pattern having terminals for connecting with external terminals via a molten metal is formed on the metal supporting board and the insulating layer. The terminals include shoulder portions corresponding to the concave portions and are concaved downward from an upper surface. First through holes penetrate the terminals in a thickness direction thereof Second through holes are formed communicating with the first through holes in portions of the insulating layer corresponding to the terminals by removing the concave portions to expose a lower surface of the terminals such that the second through holes penetrate the insulating layer in a thickness direction thereof and have a diameter larger than that of the first through holes.

Inventors: Kanagawa; Hitoki (Osaka, JP), Ohsawa; Tetsuya (Osaka, JP), Ooyabu; Yasunari (Osaka, JP)

Assignee: Nitto Denko Corporation

International Classification: H01R 9/00 (20060101); H05K 3/00 (20060101)

Expiration Date: 2019-09-13 0:00:00