Patent Number: 8,028,649

Title: Liquid ejection apparatus and resist pattern forming method

Abstract: The liquid ejection apparatus has: a head having a nozzle group including a plurality of nozzles which are aligned in a first direction and performs ejection of resist liquid onto a wiring substrate; a scanning device which causes the head and the wiring substrate to move relatively in the first direction; an ejection control device which controls the ejection of the resist liquid from the head; and a scanning control device which controls the scanning device in such a manner that the head and the wiring substrate are relatively moved only once in the first direction, through a region of the wiring substrate which corresponds to one relative movement in the first direction of the wiring substrate and the scanning device, wherein the ejection control device controls the ejection of the resist liquid from the head to cause the resist liquid to be ejected onto a same position of the wiring substrate sequentially, at prescribed time intervals, from different nozzles of the nozzle group, to deposit the resist liquid ejected onto the same position of the wiring substrate sequentially from the different nozzles of the nozzle group, in such a manner that a resist pattern having a prescribed thickness and a prescribed pattern is formed on the wiring substrate.

Inventors: Inoue; Seiichi (Kanagawa-ken, JP)

Assignee: Fujifilm Corporation

International Classification: B05B 3/00 (20060101); B05B 7/06 (20060101); B05C 11/00 (20060101); B41J 29/393 (20060101)

Expiration Date: 2019-10-04 0:00:00