Patent Number: 8,028,653

Title: System, method and apparatus for filament and support used in plasma-enhanced chemical vapor deposition for reducing carbon voids on media disks in disk drives

Abstract: A filament post used in plasma-enhanced chemical vapor deposition has an outer shell and an inner post. An electrical potential is applied only to the inner post to ensure that there is no impact on the plasma density and the carbon film properties. The inner post and the outer shell are electrically insulated by ceramic insulators, such that no electrical potential is applied to outer shell. The stress generated in the carbon film is directly related to the electrical potential of the surface to which the film is deposited. The carbon film deposited on the outer shell of the post is not highly stressed, which significantly reduces film delamination from the filament post surfaces.

Inventors: Hwang; Eric (San Francisco, CA), Wang; Jinliu (San Jose, CA), White; Richard Longstreth (Los Altos, CA)

Assignee: Hitachi Global Storage Technologies Netherlands, B.V.

International Classification: C23C 16/00 (20060101); A21B 1/00 (20060101); H01G 5/38 (20060101); A21B 1/22 (20060101); H01G 4/228 (20060101); H01G 5/06 (20060101); H05K 5/03 (20060101); H01R 9/00 (20060101); H02B 1/00 (20060101); H01G 9/10 (20060101); H01G 5/01 (20060101); H05B 1/02 (20060101)

Expiration Date: 2019-10-04 0:00:00