Patent Number: 8,066,890

Title: Spatial light modulator with multi-layer landing structures

Abstract: A method of fabricating a spatial light modulator. The method includes providing a first substrate including a first bonding surface, forming a first layer coupled to the bonding surface, wherein the first layer is characterized by a first set of material parameters, and forming a second layer coupled to the first layer, wherein the second layer is characterized by a second set of material parameters. The method also includes patterning the first layer and the second layer to form a plurality of landing structures extending to a first distance from the bonding surface of the first substrate. The method further includes providing a second substrate including a second bonding surface, joining the first bonding surface of the first substrate to the second bonding surface of the second substrate, and forming a plurality of moveable mirrors from the second substrate. During operation, the moveable mirrors make contact with the second layer.

Inventors: Yang; Xiao (Cupertino, CA)

Assignee: Miradia Inc.

International Classification: B44C 1/22 (20060101); B29D 11/00 (20060101)

Expiration Date: 2020-11-29 0:00:00