Patent Number: 8,067,316

Title: Method for manufacturing memory element

Abstract: A conductive paste including conductive particles each of which has a size of greater than or equal to 0.1 .mu.m and less than or equal to 10 .mu.m, a resin, and a solvent is placed over a first conductor and the solvent is vaporized. In this manner, a second conductor having the conductive particles and a memory layer including the resin between the first conductor and the conductive particles is formed.

Inventors: Nagata; Takaaki (Kanagawa, JP)

Assignee: Semiconductor Energy Laboratory Co., Ltd.

International Classification: H01L 21/31 (20060101)

Expiration Date: 2020-11-29 0:00:00