Patent Number: 8,071,885

Title: Printed circuit board

Abstract: A printed circuit board includes a base insulating layer and a conductor pattern provided on the base insulating layer. The conductor pattern includes a line portion linearly extending along a virtual axis line in a line region, a first bend portion extending along the axis line while being bent in a convex shape toward one side of the base insulating layer in a first bend region, and a second bend portion extending along the axis line while being bent in a convex shape toward the other side of the base insulating layer in a second bend region. The conductor pattern is formed such that the first bend portion and the second bend portion do not overlap with each other in a vertical direction when the printed circuit board is folded along a boundary.

Inventors: Honjo; Mitsuru (Ibaraki, JP), Tanaka; Takeshi (Ibaraki, JP)

Assignee: Nitto Denko Corporation

International Classification: H05K 1/00 (20060101)

Expiration Date: 2020-12-06 0:00:00