Patent Number: 8,089,004

Title: Semiconductor device including wiring excellent in impedance matching, and method for designing the same

Abstract: A semiconductor device includes an interposer, and a semiconductor chip mounted on the interposer. In a plan view, the interposer includes a first region overlapping the semiconductor chip, and a second region excluding the first region. The interposer includes at least one wiring formed astride the first region and the second region. The cross-sectional area of the wiring in the first region and the cross-sectional area of the wiring in the second region are different from each other.

Inventors: Tsukuda; Tatsuaki (Kanagawa, JP), Hirata; Masayoshi (Kanagawa, JP)

Assignee: Renesas Electronics Corporation

International Classification: H05K 1/16 (20060101)

Expiration Date: 2020-01-03 0:00:00