Patent Number: 8,089,106

Title: Image sensor and method for manufacturing the same

Abstract: Embodiments relate to an image sensor. According to embodiments, an image sensor may include a metal interconnection, readout circuitry, a first substrate, an image sensing device, and a second conduction type interfacial layer. The metal interconnection and the readout circuitry may be formed on and/or over the first substrate. The image sensing device may include a first conduction type conduction layer and a second conduction type conduction layer and may be electrically connected to the metal interconnection. The second conduction type interfacial layer may be formed in a pixel interface of the image sensing device.

Inventors: Hwang; Joon (Cheongju-si, KR)

Assignee: Dongbu HiTek Co., Ltd.

International Classification: H01L 27/148 (20060101)

Expiration Date: 2020-01-03 0:00:00