Patent Number: 8,089,294

Title: MEMS probe fabrication on a reusable substrate for probe card application

Abstract: A Micro-Electro-Mechanical-Systems (MEMS) probe is fabricated on a substrate for use in a probe card. The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate.

Inventors: Hsu; Tseng-Yang (San Marino, CA), Lam; Cao Ngoc (El Monte, CA)

Assignee: WinMENS Technologies Co., Ltd.

International Classification: G01R 31/26 (20060101)

Expiration Date: 2020-01-03 0:00:00