Patent Number: 8,089,774

Title: Printed circuit board and semiconductor memory module using the same

Abstract: A semiconductor memory module includes a printed circuit board (PCB) including a rigid PCB part and a flexible PCB part including an overlap portion, a non-overlap portion, and memory components mounted on the PCB. The rigid PCB part includes a first surface and a second surface facing the first surface. The overlap portion of the flexible PCB part overlaps the rigid PCB part, and the non-overlap portion does not overlap the rigid PCB part. The flexible PCB part may include an overlap stacked structure including at least one doubling portion.

Inventors: Choi; Hyun-Seok (Cheonan-si, KR), Kim; Yong-Hyun (Suwon-si, KR), Cho; Jung-Chan (Ssangyong-dong, KR), Hwang; Hyung-Mo (Ssangyong-dong, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: H05K 7/02 (20060101); H05K 7/06 (20060101); H05K 7/08 (20060101); H05K 7/10 (20060101)

Expiration Date: 2020-01-03 0:00:00