Patent Number: 8,303,375

Title: Polishing pads for chemical mechanical planarization and/or other polishing methods

Abstract: Embodiments herein provide polishing pads that produce high post-polish planarity, such as on a wafer substrate or other substrates. Exemplary pads include a bulk matrix and embedded polymer particles. Pads according to embodiments herein may be used to remove material over a composite substrate, comprised of two or more different materials, or a substrate comprised of a single material.

Inventors: Oliver; Michael R. (Portland, OR)

Assignee: Novaplanar Technology, Inc.

International Classification: B24B 1/00 (20060101)

Expiration Date: 2021-11-06 0:00:00