Patent Number:
8,303,375
Title:
Polishing pads for chemical mechanical planarization and/or other polishing methods
Abstract:
Embodiments herein provide polishing pads that produce high post-polish planarity, such as on a wafer substrate or other substrates. Exemplary pads include a bulk matrix and embedded polymer particles. Pads according to embodiments herein may be used to remove material over a composite substrate, comprised of two or more different materials, or a substrate comprised of a single material.
Inventors:
Oliver; Michael R. (Portland, OR)
Assignee:
Novaplanar Technology, Inc.
International Classification:
B24B 1/00 (20060101)
Expiration Date:
2021-11-06 0:00:00