Patent Number: 8,304,149

Title: Photosensitive polymer composition, method of forming relief patterns, and electronic equipment

Abstract: A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (--NH.sub.2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.

Inventors: Nunomura; Masataka (Ibaraki, JP), Ooe; Masayuki (Ibaraki, JP), Nakano; Hajime (Ibaraki, JP), Tsumaru; Yoshiko (Ibaraki, JP), Ueno; Takumi (Ibaraki, JP)

Assignee: Hitachi Chemical Dupont Microsystems Ltd.

International Classification: G03F 7/004 (20060101); G03F 7/30 (20060101)

Expiration Date: 2021-11-06 0:00:00